Senior Digital Hardware Design Engineer

D-Fend Solutions busca un ingeniero senior de diseño de hardware digital para liderar la implementación y industrialización de las unidades de procesamiento C-UAS de próxima generación. El rol abarca desde el diseño esquemático hasta la producción en masa, con foco en placas portadoras multicapa con procesadores Intel y arquitecturas COM Express. Participarás en la definición de la arquitectura de hardware, integración de múltiples sensores y colaboración con equipos multidisciplinarios.

Responsibilities

• Hardware Design Execution: Own the full lifecycle of complex digital hardware boards from schematic capture, component selection, and power distribution network (PDN) design through to high-yield mass production.
• Architecture Collaboration: Actively participate in defining the digital hardware architecture, collaborating closely on modular computing strategies, baseboard optimizations, and multi-sensor integration.
• Intel & COM Express Integration: Lead the detailed layout and integration of high-performance Intel processors and COM Express (COMe) form factors, managing complex, dense high-speed buses (PCIe Gen 4/5, DDR4/DDR5, 10GbE, USB4).
• Simulation & Signal Integrity: Execute rigorous pre- and post-layout Signal Integrity and Power Integrity (SI/PI) simulations to guarantee precise timing margins, stable power delivery, and low-noise performance on dense, fine-pitch BGA footprints.
• Production Scale-Up & DFx: Champion Design for Excellence (DFM, DFA, DFT) methodologies, boundary-scan testability, and detailed verification hardware documentation to ensure flawless transfer to manufacturing lines and eliminate field escalations.
• Cross-Discipline Collaboration: Work closely with subcontractors (layout) and other R&D disciplines—including FPGA, Embedded SW, Cyber, and Mechanical engineering—to resolve interdisciplinary space, thermal, and noise constraints.

Requirements

• B.Sc. in Electrical Engineering, Computer Engineering, or equivalent experience.
• 8+ years of proven experience as a board designer executing complex high-speed digital hardware projects through complete manufacturing cycles.
• Deep, hands-on experience designing with Intel processors and implementing COM Express (COMe) architectures, alongside modern GPUs, FPGAs, or SoCs.
• Proven track record routing and debugging a wide variety of hardware interfaces (Ethernet, PCIe, USB, MIPI, high-speed memory architectures).
• Expertise leading multi-layer PCB design involving fine-pitch BGAs, high-density interconnects (HDI), via-in-pad structures, and strict layout subcontractor management.
• Strong foundation in SI/PI fundamentals, simulation workflows, and hands-on laboratory debugging using high-bandwidth scopes and logic/protocol analyzers.
• Personal Attributes: Exceptional independent project execution skills, strong problem-solving mindset, and excellent interpersonal skills to lead multi-disciplinary alignments.

Nice to have

• High proficiency with Altium Designer and advanced simulation toolsets (HyperLynx, Ansys, or equivalent).
• Experience managing configuration and manufacturing parameters within Arena PLM.
• Familiarity with regulatory frameworks and test standards (FCC/CE/MIC compliance, EMI/EMC shielding validation).
• A foundational understanding of RF fundamentals to assist with mixed-signal isolation planning.